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Clean Hydrogen Partnership

Explosion of hydrogen at a semiconductor plant

Event

Event ID
41
Quality
Description

The incident occurred when cleaning the exhaust gas-processing equipment at a semiconductor factory.
The inside of the water scrubber was washed with hydrofluoric acid. This is a normal operation aiming at cleaning the internal surfaces from the material deposited during operation. This material consists usually in silicon oxide. However, in the case of the incident, it consisted of an external layer of oxide, covering metallic silicon. After the surface silicone oxide dissolves, the silicon and hydrogen fluoride react, generating hydrogen. The above became clear after the accident. Therefore, a backflow of air during the drainage of the cleaning fluid formed a combustible a hydrogen-air mixture, which ignited and exploded.
The water scrubber was damaged by the explosion. Two persons were exposed to the solution which was scattered and were slightly injured.

Event Initiating system
Classification of the physical effects
Hydrogen Release and Ignition
Nature of the consequences
Macro-region
Asia
Country
Japan
Date
Component involved
treatment system (gas / fume / dust)
Failure mode
internal explosion
Initiating cause
accidental hydrogen formation
Root CAUSE analysis

The INITIATING/direct cause was the accidental formation of hydrogen from an unexpected reaction.
The ignition source was probably an exothermal and explosive decomposition of compounds.
Contributing causes were:
(i) The operation management did not understand the process ongoing in the scrubber, and did not consider the possibility of unwanted reaction
(ii) Poor discipline and enforcement of procedure. The investigation revealed that the operators were supposed to put on protective gear before work, but they did not do so because they did not handle hydrofluoric acid directly. Although a operational standard was prepared, a manager who was not a chemical specialist changed the procedure.

Root causes
Date entry in HIAD
01/12/2023

Facility

Application
Electrical, electronics and micro-electronics industry
Sub-application
semiconductors production
Hydrogen supply chain stage
All components affected

scrubber

Location type
Confined
Location
industrial area
Operational condition
Pre-event occurrences

The usual procedure for the cleaning of the scrubber was to wash it with hydrofluoric acid. This is a normal operation aiming at cleaning the internal surfaces from the material deposited during operation, which normally consists in silicon oxide.

Emergency & Consequences

Number of fatalities
0
Number of injured persons
1
Post-event summary

Two persons were exposed to the acid solution which was scattered around the place by the explosion and were slightly injured.
The water scrubber was damaged by the explosion.

Emergency action

The only emergency action was the rescue of the injured worker.

Lesson Learnt

Corrective Measures

Changing the structure to prevent a reverse flow of air.
Installing a flow meter and conducting enough purging with nitrogen.
Not allowing operators to change operation standards by their own judgment.
Always wearing the prescribed protective gear.

In-depth data

Release type
gas
Involved substances (% vol)
H2 100%
Probable IGNITION SOURCE
Explosion type

References

Sources categories
JST
Reference & weblink

JST failures database:
https://www.shippai.org/fkd/en/cfen/CC1200095.html
(accessed Dec 2023)